Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11407869 | Prepreg, metal-clad laminate and printed wiring board | Keiko Kashihara, Rihoko Watanabe | 2022-08-09 |
| 11365274 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Yiqun Wang | 2022-06-21 |
| 11234329 | Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board | Rihoko Watanabe, Keiko Kashihara | 2022-01-25 |