Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527420 | Micro-fabricated, stress-engineered members formed on passivation layer of integrated circuit | Christopher L. Chua, Qian Wang | 2022-12-13 |
| 11440307 | Method and system for mass assembly of thin-film materials | JengPing Lu, Sourobh Raychaudhuri | 2022-09-13 |
| 11302554 | Micro assembler with fine angle control | JengPing Lu, David K. Biegelsen | 2022-04-12 |
| 11289443 | Microspring structure for hardware trusted platform module | Warren B. Jackson, Vanishree Rao | 2022-03-29 |
| 11242244 | Method of controlling the placement of micro-objects on a micro-assembler | Anne Plochowietz, Bradley Rupp, JengPing Lu, Julie A. Bert, Lara S. Crawford +3 more | 2022-02-08 |