Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527420 | Micro-fabricated, stress-engineered members formed on passivation layer of integrated circuit | Qian Wang, Eugene M. Chow | 2022-12-13 |
| 11513301 | Chip-scale optoelectronic transceiver having microsprings on an interposer substrate | — | 2022-11-29 |
| 11279084 | Apparatus for continuous high-speed 3D printing | Ashish Pattekar, Warren B. Jackson, Anne Plochowietz, JengPing Lu, Jamie Kalb +2 more | 2022-03-22 |