Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521947 | Space efficient flip chip joint design | — | 2022-12-06 |
| 11515238 | Power die package | You Ge, Meng Kong Lye, Zhijie Wang | 2022-11-29 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521947 | Space efficient flip chip joint design | — | 2022-12-06 |
| 11515238 | Power die package | You Ge, Meng Kong Lye, Zhijie Wang | 2022-11-29 |