Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515238 | Power die package | Meng Kong Lye, Zhijie Wang, Kabir Mirpuri | 2022-11-29 |
| 11456188 | Method of making flexible semiconductor device with graphene tape | Meng Kong Lye, Zhijie Wang | 2022-09-27 |