Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508606 | Technique for handling diced wafers of integrated circuits | Antonius Hendrikus Jozef Kamphuis, Guido Albermann | 2022-11-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508606 | Technique for handling diced wafers of integrated circuits | Antonius Hendrikus Jozef Kamphuis, Guido Albermann | 2022-11-22 |