Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508606 | Technique for handling diced wafers of integrated circuits | Guido Albermann, Johannes Cobussen | 2022-11-22 |
| 11380634 | Apparatuses and methods for coupling a waveguide structure to an integrated circuit package | Antonius Johannes Matheus de Graauw, Sander Jacobus Geluk | 2022-07-05 |