Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521925 | Semiconductor module | Yoshinari Ikeda, Motohito HORI | 2022-12-06 |
| 11434341 | Resin sheet and adhesive-layer-having resin sheet | Yusuke YAMANARI, Makoto Saito, Kenji Furuta | 2022-09-06 |
| 11251163 | Semiconductor device having circuit board interposed between two conductor layers | Motohito HORI, Yoshinari Ikeda | 2022-02-15 |