Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11531075 | Method and apparatus for integrating current sensors in a power semiconductor module | Robert D. Lorenz, Minhao Sheng, Hiroyuki Nogawa, Eiji Mochizuki | 2022-12-20 |
| 11521925 | Semiconductor module | Akira Hirao, Motohito HORI | 2022-12-06 |
| 11444004 | Cooler | Ryoichi Kato, Hiromichi Gohara, Tomoyuki Miyashita, Shingo Otake | 2022-09-13 |
| 11417634 | Semiconductor module having an N terminal, A P terminal and an output terminal and method of fabricating the semiconductor module | Motohito HORI | 2022-08-16 |
| 11410922 | Semiconductor device comprising a capacitor | Ryoichi Kato, Yuma MURATA | 2022-08-09 |
| 11398450 | Semiconductor module | Ryoichi Kato, Yuma MURATA, Naoyuki Kanai, Akito NAKAGOME | 2022-07-26 |
| 11398448 | Semiconductor module | Ryoichi Kato, Yuma MURATA, Naoyuki Kanai, Akito NAKAGOME | 2022-07-26 |
| 11335660 | Semiconductor module | Ryoichi Kato, Yuma MURATA, Naoyuki Kanai, Akito NAKAGOME | 2022-05-17 |
| 11315854 | Semiconductor device and method of manufacturing semiconductor device | Ryoichi Kato, Hiromichi Gohara, Yoshikazu Takahashi, Kuniteru Mihara, Isao Takahashi | 2022-04-26 |
| 11309276 | Semiconductor module | Yuma MURATA, Ryoichi Kato, Naoyuki Kanai, Akito NAKAGOME | 2022-04-19 |
| 11251163 | Semiconductor device having circuit board interposed between two conductor layers | Motohito HORI, Akira Hirao | 2022-02-15 |