Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373934 | Bonding wire for semiconductor device | Daizo Oda, Takashi Yamada, Motoki ETO, Tomohiro Uno | 2022-06-28 |
| 11342299 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2022-05-24 |