Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342299 | Bonding wire for semiconductor devices | Daizo Oda, Teruo Haibara, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2022-05-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342299 | Bonding wire for semiconductor devices | Daizo Oda, Teruo Haibara, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2022-05-24 |