Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264330 | Chip package with connection portion that passes through an encapsulation portion | Yongtae Kwon, Eung Ju Lee, Yong Woon Yeo, Yun Mook Park, Hyo Young Kim +1 more | 2022-03-01 |