Issued Patents 2022
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508729 | Semiconductor die with decoupling capacitor and manufacturing method thereof | — | 2022-11-22 |
| 11502070 | Electronic module | — | 2022-11-15 |
| 11479778 | Construction of accumulating Mucor circinelloides strain and industrial application of constructed strain | Yuanda Song, Caili Sun, Huaiyuan Zhang, Meiling Chen | 2022-10-25 |
| 11469219 | Dual die semiconductor package and manufacturing method thereof | — | 2022-10-11 |
| 11469216 | Dual-die semiconductor package and manufacturing method thereof | Chun-Huang Yu | 2022-10-11 |
| 11414650 | Construction method of Mucor circinelloides cell factory for producing dihomo-gamma-linolenic acid and fermentation technology | Yuanda Song, Md. Ahsanul Kabir Khan, Junhuan Yang, Huaiyuan Zhang, Qing Liu | 2022-08-16 |
| 11407733 | Biarylmethyl heterocycles | Eldon Scott Priestley, Samuel Kaye Reznik, Edward H. Ruediger, James Gillard, Oz Scott Halpern +5 more | 2022-08-09 |
| 11407793 | Dicarboxylic acid transporter for increasing oil yield of Mucor circinelloides | Yuanda Song, Junhuan Yang, Shaoqi Li | 2022-08-09 |
| 11348893 | Semiconductor package | — | 2022-05-31 |
| 11345937 | Construction of Mucor circinelloides cell factory for producing stearidonic acid and fermentation technology thereof | Yuanda Song, Md. Ahsanul Kabir Khan, Junhuan Yang, Yao ZHANG, Shaoqi Li | 2022-05-31 |
| 11322467 | Memory package structure | — | 2022-05-03 |
| 11309288 | Electronic system, die assembly and device die | — | 2022-04-19 |
| 11250925 | Ground bounce generator in device under test, automatic test equipment, and method of testing with ground noise | — | 2022-02-15 |
| 11239220 | Semiconductor package and method of fabricating the same | — | 2022-02-01 |
| 11227814 | Three-dimensional semiconductor package with partially overlapping chips and manufacturing method thereof | Chun-Huang Yu | 2022-01-18 |
| 11222839 | Semiconductor structure | — | 2022-01-11 |
| 11222871 | Semiconductor package having multiple voltage supply sources and manufacturing method thereof | — | 2022-01-11 |