Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469216 | Dual-die semiconductor package and manufacturing method thereof | Wu-Der Yang | 2022-10-11 |
| 11227814 | Three-dimensional semiconductor package with partially overlapping chips and manufacturing method thereof | Wu-Der Yang | 2022-01-18 |