Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11518867 | Resin composition, semiconductor sealing material, one-part adhesive and adhesive film | Ayako Sato | 2022-12-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11518867 | Resin composition, semiconductor sealing material, one-part adhesive and adhesive film | Ayako Sato | 2022-12-06 |