Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11518867 | Resin composition, semiconductor sealing material, one-part adhesive and adhesive film | Masashi Kajita | 2022-12-06 |
| 11214369 | System, control device, and module | Tatsushi Tsutsui, Koji KUSUNOKI, Akihiro Baba, Naoyoshi Hashimoto, Osamu Kamimura +3 more | 2022-01-04 |