Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302593 | Electronic component package and method for manufacturing the same | Yoichi Takagi, Akio Katsube, Yoshitaka Echikawa | 2022-04-12 |
| 11276631 | Module and method of manufacturing module | Akio Katsube | 2022-03-15 |