Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302593 | Electronic component package and method for manufacturing the same | Yoshitaka Matsukawa, Akio Katsube, Yoshitaka Echikawa | 2022-04-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302593 | Electronic component package and method for manufacturing the same | Yoshitaka Matsukawa, Akio Katsube, Yoshitaka Echikawa | 2022-04-12 |