Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282797 | Manufacturing method of high frequency module and high frequency module having groove in sealing resin layer | Tadashi Nomura | 2022-03-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282797 | Manufacturing method of high frequency module and high frequency module having groove in sealing resin layer | Tadashi Nomura | 2022-03-22 |