Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521906 | Circuit module | Tetsuya Oda, Hideki Shinkai, Toru Koidesawa | 2022-12-06 |
| 11342280 | Module and method for manufacturing the same | Shin Furuya, Toru Koidesawa, Motohiko KUSUNOKI, Tetsuya Oda | 2022-05-24 |
| 11309259 | High frequency module | Takafumi Kusuyama | 2022-04-19 |
| 11282797 | Manufacturing method of high frequency module and high frequency module having groove in sealing resin layer | Toru Komatsu | 2022-03-22 |
| 11270922 | Radio-frequency module | Takafumi Kusuyama, Yoshitaka Echikawa | 2022-03-08 |