Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393732 | Method for testing electrical performance of packaged chip | Meng MEI, Gang Shi, Guangfeng Li | 2022-07-19 |
| 11270918 | Laminate structure and test method for detecting inter-metal dielectric layer defects | Xiong Zhang, Chunlai SUN, Gang Shi | 2022-03-08 |