Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11215921 | Residual layer thickness compensation in nano-fabrication by modified drop pattern | Craig William Cone, Logan L. Simpson, Wei Zhang, James W. Irving | 2022-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11215921 | Residual layer thickness compensation in nano-fabrication by modified drop pattern | Craig William Cone, Logan L. Simpson, Wei Zhang, James W. Irving | 2022-01-04 |