Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11215921 | Residual layer thickness compensation in nano-fabrication by modified drop pattern | Ecron D. Thompson, Craig William Cone, Wei Zhang, James W. Irving | 2022-01-04 |
LS
Logan L. Simpson
Overall (2022): #357,658 of 548,613Top 70%
1
Patents 2022