Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462451 | Semiconductor device having terminals including heat dissipation portions, and method of manufacturing thereof | Shohta Oh, Hiroyuki Nakamura, Kazuhiro KAWAHARA | 2022-10-04 |
| 11387174 | Semiconductor device | Kazuhiro KAWAHARA, Hiroyuki Nakamura | 2022-07-12 |