Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462451 | Semiconductor device having terminals including heat dissipation portions, and method of manufacturing thereof | Toshitaka Sekine, Hiroyuki Nakamura, Kazuhiro KAWAHARA | 2022-10-04 |