Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257760 | Semiconductor device having metal wire bonded to plural metal blocks connected to respective circuit patterns | Seiji Saiki, Masaru Furukawa, Takamasa Oda, Hideki Tsukamoto | 2022-02-22 |