Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11489046 | Semiconductor device | Teruyuki Ohashi, Hiroshi Kono | 2022-11-01 |
| 11362219 | Semiconductor device | Teruyuki Ohashi, Hiroshi Kono | 2022-06-14 |
| 11257760 | Semiconductor device having metal wire bonded to plural metal blocks connected to respective circuit patterns | Seiji Saiki, Takuro Mori, Takamasa Oda, Hideki Tsukamoto | 2022-02-22 |