Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456278 | Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages | — | 2022-09-27 |
| 11410973 | Microelectronic device assemblies and packages and related methods and systems | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more | 2022-08-09 |
| 11380665 | Semiconductor dice assemblies, packages and systems, and methods of operation | Shiro Uchiyama | 2022-07-05 |