Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527503 | Method for manufacturing semiconductor package | You-Jin Kyung, Minsu Jeong | 2022-12-13 |
| 11515245 | Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same | Minsu Jeong, You-Jin Kyung, Byung Ju Choi, Woo Jae Jeong, Eunbyurl CHO | 2022-11-29 |
| 11479699 | Adhesive film for semiconductor | Jong Min Jang, Heejung KIM | 2022-10-25 |
| 11466184 | Adhesive composition | Mi JANG, Sera Kim, Ji Ho HAN, Bora YEON, Kwang Su Seo | 2022-10-11 |
| 11466178 | Back-grinding tape | Eun Yeong KIM, Sera Kim, Sang Hwan Kim, Sung Chan Park, Mi Seon YOON | 2022-10-11 |
| 11424153 | Back grinding tape | Mi Seon YOON, Sera Kim, Bora YEON, Sang Hwan Kim, Eun Yeong KIM | 2022-08-23 |
| 11404301 | Dicing die-bonding film | Ji Ho HAN, Se Ra Kim, Mun Seop Song, Yeong Im Yu | 2022-08-02 |
| 11361878 | Method for manufacturing insulating film and semiconductor package | Woo Jae Jeong, You-Jin Kyung, Byung Ju Choi, Bo Yun Choi, Min Su Jeong | 2022-06-14 |