Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527503 | Method for manufacturing semiconductor package | You-Jin Kyung, Kwang Joo Lee | 2022-12-13 |
| 11515245 | Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same | You-Jin Kyung, Byung Ju Choi, Woo Jae Jeong, Kwang Joo Lee, Eunbyurl CHO | 2022-11-29 |