Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251122 | Semiconductor device having a bonding pad area of a first wiring layer overlaps a bonding pad electrode of a second wiring layer | Masayuki Akou, Mitsuhiro Noguchi | 2022-02-15 |