Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482489 | Semiconductor device and method of manufacturing the same | Shingo Nakajima, Ryota Asada, Hidenobu Nagashima | 2022-10-25 |
| 11302696 | Semiconductor device and method of manufacturing semiconductor device | Hiroyuki Kutsukake | 2022-04-12 |
| 11251122 | Semiconductor device having a bonding pad area of a first wiring layer overlaps a bonding pad electrode of a second wiring layer | Mitsuhiro Noguchi, Yuuichi Tatsumi | 2022-02-15 |