Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521920 | Plurality of power semiconductor chips between a substrate and leadframe | — | 2022-12-06 |
| 11482463 | Vertically attaching a chip to a substrate | Jeonghun Cho | 2022-10-25 |
| 11417577 | Semiconductor package and method of manufacturing the same | — | 2022-08-16 |
| 11393744 | Metal powder layers between substrate, semiconductor chip and conductor | — | 2022-07-19 |
| 11367666 | Clip, lead frame, and substrate used in semiconductor package having engraved pattern formed thereon and the semiconductor package comprising the same | Jeong Hun Cho, Soon Seong Choi | 2022-06-21 |
| 11362021 | Pressurizing members for semiconductor package | Jeonghun Cho | 2022-06-14 |
| 11289397 | Heat sink board for a semiconductor device | Young Hun Kim, Jeonghun Cho, So Young Choi | 2022-03-29 |
| 11270969 | Semiconductor package | Jeonghun Cho, Young Hun Kim, Taeheon Lee | 2022-03-08 |