Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482463 | Vertically attaching a chip to a substrate | Yun Hwa CHOI | 2022-10-25 |
| 11362021 | Pressurizing members for semiconductor package | Yun Hwa CHOI | 2022-06-14 |
| 11289397 | Heat sink board for a semiconductor device | Yun Hwa CHOI, Young Hun Kim, So Young Choi | 2022-03-29 |
| 11270969 | Semiconductor package | Yun Hwa CHOI, Young Hun Kim, Taeheon Lee | 2022-03-08 |