Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11463173 | Systems and methods for wafer-level testing of transmitter-receiver links | Xingyu Zhang, Dawei Zheng, Tongqing Wang | 2022-10-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11463173 | Systems and methods for wafer-level testing of transmitter-receiver links | Xingyu Zhang, Dawei Zheng, Tongqing Wang | 2022-10-04 |