Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11463173 | Systems and methods for wafer-level testing of transmitter-receiver links | Xingyu Zhang, Tongqing Wang, Zhoufeng Ying | 2022-10-04 |
| 11336370 | Integrated multi-channel photonics transmitter chip having variable power dividers | Xingyu Zhang, Tongqing Wang | 2022-05-17 |