Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535007 | Bendable resin having patterned elements for improving penetration of wireless communication signals | Wai Keung Lo, Chun Kit Kendrick Wong, Chun Hung Lam, Siu Yee Mok, Hang Wong | 2022-12-27 |
| 11456775 | Slotted electrically conductive structure for improving indoor penetration of wireless communication signal | Chun Kai Leung, Hang Wong, Chi Sun Yu | 2022-09-27 |