Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535007 | Bendable resin having patterned elements for improving penetration of wireless communication signals | Kung Bo Ng, Chun Kit Kendrick Wong, Chun Hung Lam, Siu Yee Mok, Hang Wong | 2022-12-27 |