Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469148 | Semiconductor package having a redistribution layer for package-on-package structure | Youngkwan Lee, Youngsik Hur, Taehee Han, Yonghoon Kim | 2022-10-11 |
YL
Yuntae Lee
Overall (2022): #192,856 of 548,613Top 40%
1
Patents 2022