Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469148 | Semiconductor package having a redistribution layer for package-on-package structure | Youngsik Hur, Taehee Han, Yonghoon Kim, Yuntae Lee | 2022-10-11 |
| 11239148 | Semiconductor package | Youngsik Hur, Taehee Han | 2022-02-01 |