Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482480 | Package substrate including an optically-cured dielecetric layer and method for manufacturing the package substrate | — | 2022-10-25 |
| 11462484 | Electronic package with wettable flank and shielding layer and manufacturing method thereof | Bernd Karl Appelt, Kay Stephan Essig | 2022-10-04 |
| 11398421 | Semiconductor substrate and method for manufacturing the same | Chun-Che Lee, Ming-Chiang Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee | 2022-07-26 |
| 11322468 | Semiconductor device including metal holder and method of manufacturing the same | Bernd Karl Appelt | 2022-05-03 |
| 11322428 | Semiconductor device package and method of manufacturing the same | Bernd Karl Appelt | 2022-05-03 |
| 11322454 | Semiconductor device packages and method of manufacturing the same | Bernd Karl Appelt | 2022-05-03 |
| 11282777 | Semiconductor package and method of manufacturing the same | Bernd Karl Appelt | 2022-03-22 |