Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462484 | Electronic package with wettable flank and shielding layer and manufacturing method thereof | You-Lung Yen, Kay Stephan Essig | 2022-10-04 |
| 11322428 | Semiconductor device package and method of manufacturing the same | You-Lung Yen | 2022-05-03 |
| 11322454 | Semiconductor device packages and method of manufacturing the same | You-Lung Yen | 2022-05-03 |
| 11322468 | Semiconductor device including metal holder and method of manufacturing the same | You-Lung Yen | 2022-05-03 |
| 11282777 | Semiconductor package and method of manufacturing the same | You-Lung Yen | 2022-03-22 |