Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469148 | Semiconductor package having a redistribution layer for package-on-package structure | Youngkwan Lee, Youngsik Hur, Taehee Han, Yuntae Lee | 2022-10-11 |
| 11251882 | Device and method for calibrating phased array antenna | Manh-Tuan Dao, Yuichi Aoki | 2022-02-15 |
| 11217531 | Interconnect structure having nanocrystalline graphene cap layer and electronic device including the interconnect structure | Kyung-Eun BYUN, Keunwook Shin, Hyeonjin Shin, Hyunjae Song, Changseok LEE +2 more | 2022-01-04 |