Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527547 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2022-12-13 |
| 11430766 | Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same | Jun Liu | 2022-08-30 |
| 11367729 | Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same | Jun Liu | 2022-06-21 |
| 11302700 | Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same | Jun Liu | 2022-04-12 |
| 11302706 | Bonded unified semiconductor chips and fabrication and operation methods thereof | Jun Liu | 2022-04-12 |