Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417579 | Packaged semiconductor devices for high voltage with die edge protection | Woochan Kim, Anindya Poddar | 2022-08-16 |
| 11387179 | IC package with half-bridge power module | Makoto Shibuya, Kengo Aoya, Woochan Kim | 2022-07-12 |
| 11329025 | Multi-chip package with reinforced isolation | Woochan Kim | 2022-05-10 |
| 11302615 | Semiconductor package with isolated heat spreader | Anindya Poddar, Woochan Kim | 2022-04-12 |