Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387179 | IC package with half-bridge power module | Kengo Aoya, Woochan Kim, Vivek Kishorechand Arora | 2022-07-12 |
| 11217513 | Integrated circuit package with pre-wetted contact sidewall surfaces | Daiki Komatsu | 2022-01-04 |
| 11217522 | Semiconductor apparatus and method having a lead frame with floating leads | — | 2022-01-04 |