Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424211 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2022-08-23 |
| 11312840 | Organic-inorganic hybrid composition, and article and optical component including the same | Yoshiyuki Oishi, Ryosuke Kamitani, Yukika Yamada | 2022-04-26 |