Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404311 | Metallic interconnect structures with wrap around capping layers | Cornelius Brown Peethala, Kedari Matam, Chih-Chao Yang | 2022-08-02 |
| 11315830 | Metallic interconnect structures with wrap around capping layers | Cornelius Brown Peethala, Kedari Matam, Chih-Chao Yang | 2022-04-26 |