Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11445650 | Localized rework using liquid media soldering | Theron Lee Lewis, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2022-09-13 |
| 11268809 | Detecting and correcting deficiencies in surface conditions for bonding applications | Jennifer I. Bennett, James D. Bielick, David J. Braun, Timothy P. Younger, Theron Lee Lewis +2 more | 2022-03-08 |
| 11245238 | Tool for shaping contact tab interconnects at a circuit card edge | Timothy P. Younger, Theron Lee Lewis, James D. Bielick, Jennifer I. Bennett, David J. Braun +2 more | 2022-02-08 |