Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11445650 | Localized rework using liquid media soldering | Theron Lee Lewis, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2022-09-13 |
| 11310950 | Liquid metal infiltration rework of electronic assembly | Mark K. Hoffmeyer | 2022-04-19 |
| 11278977 | Liquid metal infiltration rework of electronic assembly | Mark K. Hoffmeyer | 2022-03-22 |
| 11268809 | Detecting and correcting deficiencies in surface conditions for bonding applications | Jennifer I. Bennett, James D. Bielick, David J. Braun, Theron Lee Lewis, Stephen M. Hugo +2 more | 2022-03-08 |
| 11245238 | Tool for shaping contact tab interconnects at a circuit card edge | Theron Lee Lewis, James D. Bielick, Jennifer I. Bennett, David J. Braun, Tim Bartsch +2 more | 2022-02-08 |